Exactly one week ago we got the first details about Qualcomm’s next flagship chipset – the Snapdragon 888+ thanks to a Geekbench listing. Today, we get our first set of details via well-known leaker Evan Blass who shared a preliminary spec sheet of the upcoming flagship SoC on his Twitter.
“SM8450 is Qualcomm’s next-gen premium system-on-chip (SoC). It has an integrated Snapdragon X65 5G Modem-RF system. It is fabricated on a 4nm process.” pic.twitter.com/u1GXMhOWBf
— Evan Blass (@evleaks) June 3, 2021
The SM8450 or Waipio as its known internally will be fabricated on a 4nm process and features the latest Qualcomm X65 5G modem which offers wireless download speeds of up to 10 Gbps compared to the 7.5Gbps on the X60 5G modem in the Snapdragon 888.
Elsewhere, the SD 888+ will debut the brand new ARMv9 chip architecture with Kryo 780 cores at the helm. The GPU front is said to be upgraded from the Adreno 660 to the unannounced Adreno 730 but we don’t get further details. The camera interface will rely on the all-new Spectra 680 ISP which is also yet to be detailed.
Qualcomm’s FastConnect 6900 chip will handle Bluetooth 5.2 and Wi-Fi 6E connectivity. The leak also details new Adreno 665 video processing unit and an Adreno 1195 display processing unit.