Contrary to many people’s beliefs, Samsung has just announced that it plans to be manufacturing 24 gigabyte DDR5 memory chips. The news comes after the brand seemingly agreed to the demand of enterprise customers and markets that utilize cloud datacenters.
With Samsung offering up a solution to the market’s needs, it will allow the company to produce memory capacities of up to 768 gigabytes – per stick. This will be groundbreaking for client servers, whilst also offer high memory options for those client’s computers.
Check out our complete guide on DDR5 memory here.
A Samsung executive said the following during the recent earnings conference –
“In order to meet the demand and request by the cloud companies, we are also developing a maximum 24Gb DDR5 product…”
As far as products go, Samsung has already showcased to consumers (and enthusiasts) its 512GB RDIMM that makes use of 32 x 16GB stacks – modeled from their 8 x 16GB products that currently reside in today’s market. This particular process also allow3s for efficient signaling and keeps power levels to a minimum.
New data also suggests that Samsung actually has the option of increasing the capacity of a 32chip module to the impressive heights of 768 GB by taking the 24 GB memory IC layout and using them in what is considered ‘8-hi’ stacks. Utilizing this particular process, Samsung could design RDIMM that would utilize a server’s CPU channels that use two modules on either channel – effectively adding 12 TB of DDR5 memory. At the time of writing this, the Intel Xeon Ice Lake-SP processor only offers support for a max of six TB – meaning this process would double the available memory for supportive processors.
If you’re in the market for a high-capacity DDR5 module, the market currently offers access to a 16 GB DDR5 offering – with Samsung stating that it will be ‘some time’ before the consumer market gets its hands on 24GB alternatives. As the production of today’s RAM has technical limitations, it’s difficult for manufacturers to increase the capacity of memory IC. To do so would effectively remove available space for capacitors and DRAM transistors – causing problems that would potentially see the RAM no function on node-to-node structures.
Samsung also stated:
“Our 14 nm DRAM is the smallest design rule in the industry’s 14 nm class…
…We will mass produce this product in the second half by applying EUV to five layers.”
So, there you have it, the latest news from Samsung regarding its new 24 GB ICs. At the time of writing this, there is no available date set for the production or release of 24GB DDR5 memory chips. At present, Samsung is testing 16GB-based 512GB RDIMMs for server usage – ultimately in an attempt to remain competitive with rivals that are openly planning 24GB-based 768 GB RDIMMs.